According to a announcement by the Ministry of Commerce on September 13th， the ministry has initiated an anti-dumping investigation into imported analog chips originating from the United States.
The announcement indicates that on July 23， 2025， the Ministry of Commerce received a formal anti-dumping investigation application submitted by the Jiangsu Semiconductor Industry Association (hereinafter referred to as the Applicant) on behalf of the domestic relevant analog chip industry， requesting an anti-dumping investigation into imported analog chips originating from the United States.
In accordance with the relevant provisions of the “Regulations of the People’s Republic of China on Anti-dumping，” the Ministry of Commerce reviewed the qualifications of the Applicant， the circumstances of the products under investigation， the situation of comparable products in China， the impact of the products under investigation on the domestic industry， and the relevant circumstances of the countries concerned. Based on the evidence provided by the Applicant and the preliminary review by the Ministry of Commerce， the total output of the Applicant’s relevant analog chips meets the provisions of the “Regulations of the People’s Republic of China on Anti-dumping” regarding applicant qualifications.
Concurrently， the application includes content and relevant evidence required for the initiation of an anti-dumping investigation as stipulated in Articles 14 and 15 of the “Regulations of the People’s Republic of China on Anti-dumping.”
Based on the aforementioned review results， in accordance with Article 16 of the “Regulations of the People’s Republic of China on Anti-dumping，” the Ministry of Commerce has decided to initiate an anti-dumping investigation into imported analog chips originating from the United States， effective September 13， 2025.
The announcement is as follows:
I. Initiation of Investigation and Investigation Period
Starting from the date of this announcement， the Ministry of Commerce will initiate an anti-dumping investigation into imported analog chips originating from the United States. The dumping investigation period determined for this investigation is from January 1， 2024， to December 31， 2024， and the injury investigation period is from January 1， 2022， to December 31， 2024.
II. Products Under Investigation and Scope of Investigation
Scope of Investigation: Imported analog chips originating from the United States.
Name of Product Under Investigation: Certain Analog IC Chip.
English Name: Certain Analog IC Chip.
Product Description and Main Uses: General-purpose interface chips (Commodity Interface IC Chip) and gate driver chips (Gate Driver IC Chip) using 40nm and above process technology in relevant analog chips.
Among these:
General-purpose interface chips are integrated circuit chips designed to provide a variety of interface types， used to connect various devices， systems， or components to achieve efficient data transmission and signal conversion. The general-purpose interface chips under investigation include:
1. Controller Area Network (CAN) interface transceiver chips that comply with the ISO11898 standard， used for sending and receiving signals between systems in automotive and other industrial products;
2. RS485 interface transceiver chips that comply with the TIA/EIA-485 standard， used for sending and receiving signals between various devices in industrial systems;
3. Bidirectional two-wire synchronous serial bus (I2C) interface chips manufactured using a low-speed serial bus method utilizing serial data lines and serial clock lines， used for switching and expanding signal buffer relay channels between various boards or chips in devices;
4. Digital isolator chips that comply with the International Electrotechnical Commission IEC 60747-5-2 standard， used for insulated communication between high and low voltage systems in automotive and other industrial products， or for enhancing communication anti-interference performance;
5. Other general-purpose interface chips that are simultaneously compatible with the above types.
Gate driver chips are integrated circuit chips used to enhance the gate driving signal output of a controller to control the conduction and cutoff of power semiconductor devices. Gate driver chips provide the necessary voltage and current levels to effectively turn these semiconductor switches on and off， thereby achieving power conversion and control. The gate driver chips under investigation include:
1. Low-Side Gate Driver IC Chip;
2. Half-Bridge/Multi-Channel Gate Driver IC Chip;
3. Isolated Gate Driver IC Chip.
The gate driver chips under investigation possess the following functions: 1. Converting the controller’s low-voltage signals into higher voltage or larger current drive signals to achieve stable conduction and cutoff of power devices; 2. Providing transient pull-up and pull-down current to improve the switching speed of power devices and reduce switching losses.
The general-purpose interface chips and gate driver chips under investigation include finished chips， as well as wafers and dies that can be used to produce chips with the same functions， and products with the same functions in future development.
This product is classified under the “Import and Export Tariff of the People’s Republic of China”: 85423990. Other products under this tariff code are not included in this investigation.
