According to media reports， Apple’s A20 series chips will be available in two versions: the standard A20 (codenamed Borneo) and the A20 Pro (codenamed Borneo Ultra). These chips will utilize TSMC’s 2nm process technology， marking Apple’s debut with 2nm smartphone chips.
Historically， Apple has adopted a differentiated product strategy for its A-series chips， with standard iPhones featuring standard chips and Pro models equipped with more powerful Pro versions. This approach has allowed Apple to cater to different market segments and price points.
Notably， Apple’s iPhone 18 series， slated for release next year， will not see a simultaneous launch of both standard and Pro models. Instead， the company is expected to implement a phased release strategy. This staggered launch could potentially allow Apple to manage production and marketing efforts more effectively， ensuring a smoother rollout for each tier of the iPhone lineup.
It is anticipated that in September of next year， Apple will first introduce the iPhone 18 Pro， iPhone 18 Pro Max， and a foldable iPhone， possibly even an iPhone 18 Air. The iPhone 18 and iPhone 18e are expected to launch in the first half of 2027. Consequently， the A20 and A20 Pro chips might not be unveiled at the same time as their corresponding iPhone models.
Significant design changes are also expected for the A20 series. Leaks suggest a redesign where RAM will be directly integrated onto the same wafer as the CPU， GPU， and Neural Engine. This innovative approach， deviating from the traditional method of placing RAM adjacent to the chip and connected via a silicon interposer， could dramatically reduce chip size and enhance operational efficiency. Such an integration could lead to substantial improvements in power consumption and heat dissipation， both critical factors for modern mobile devices.
Through this upgrade， Apple is not only boosting chip performance but also furthering advancements in chip integration. The expected powerful performance of the A20 series chips promises a smoother user experience for future iPhones， particularly in multitasking capabilities and intelligent application performance. The combined benefits of 2nm process technology and the new integrated design are poised to set new benchmarks for mobile chip capabilities.
