MediaTek has officially announced its launch event for September 22nd， preempting Qualcomm in releasing its next-generation processor， the Dimensity 9500.
Blogger “Digital Chat Station” has provided early details on the specifications of this new chip. It will be manufactured using TSMC’s 3nm process， specifically the N3P node， promising significant upgrades in both performance and power efficiency compared to previous generations. This advancement in manufacturing technology is a key factor in achieving higher clock speeds and better energy management， crucial for flagship mobile devices.
The CPU configuration continues with an all-big-core design， consisting of 1 core clocked at 4.21GHz (Travis)， 3 cores at 3.50GHz (Alto)， and 4 cores at 2.7GHz (Gelas). The Travis and Alto cores are based on Arm’s new generation X9 architecture， supporting the SME instruction set， while the Gelas cores utilize Arm’s A7 architecture. This heterogeneous core design aims to balance peak performance for demanding tasks with sustained efficiency for everyday operations.
The GPU is a brand-new Mali-G1-Ultra MC12， operating at approximately 1MHz. This core features a completely new microarchitecture， significantly boosting ray tracing performance while also reducing power consumption. The inclusion of a new GPU architecture is vital for mobile gaming and graphics-intensive applications， especially as mobile devices increasingly support advanced visual technologies.
Further specifications include a 16MB L3 cache， 10MB SLC， support for the SME instruction set， and an NPU 9.0 expected to deliver 100 TOPS of performance. It will also support quad-channel LPDDR5x at 10667Mbps and UFS 4.1. The substantial cache and high memory bandwidth are critical for smooth multitasking and rapid data access， while the powerful NPU will enhance AI capabilities， such as image processing and on-device machine learning.
Notably， the blogger also revealed that the Dimensity 9500 chip incorporates low-level hardware hardening for Vivo’s V3+ imaging chip， suggesting it will be exclusively optimized for Vivo’s flagship devices. This strategic partnership points towards a deep integration designed to maximize the imaging capabilities of future Vivo smartphones.
From current timelines， the Vivo X300 series is expected to be the first to globally launch with the Dimensity 9500， with a release anticipated in October. In addition to its powerful performance， this device is also expected to debut with a jointly developed 200-megapixel main camera from Samsung， the HPB， complemented by a 50-megapixel ultrawide lens and a 50-megapixel periscope telephoto lens. This combination of a cutting-edge processor and a high-resolution， versatile camera system positions the Vivo X300 series as a significant contender in the premium smartphone market.
