Kuaitech (October 3rd) reports that AMD’s AM4 platform is poised to enjoy an impressive 12-year lifespan， a testament to its enduring support and value for consumers.
With the Ryzen 7000 series ushering in the new AM5 platform， AMD has officially committed to a five-year support window， extending to 2027. While recent discussions have touched upon the possibility of an AM6 platform and the potential exclusion of Zen 6 support， a positive development has emerged: it is now widely believed that future Zen 6 upgrades will not necessitate a motherboard change.
Information shared by a representative from motherboard manufacturer MSI on Discord indicates that their motherboards will accommodate future CPU generations， confirming that current 800-series motherboards will indeed be compatible with upcoming CPUs.
According to previous reports， AMD is expected to launch its Zen 6 architecture processors in Q3-Q4 of 2026. These processors are anticipated to feature CCD cores upgraded to 12 cores/24 threads， with 48MB of L3 cache. The IOD (I/O Die) will also integrate new graphics cores. However， earlier rumors suggesting an upgrade to the 2nm process for CCDs and the N2P high-performance process for IODs are considered overly ambitious， as mass production of N2P is unlikely even next year.
Currently， Zen 5 utilizes a 4nm process for its CCD and a 6nm process for its IOD. An upgrade to a 3nm process for at least the CCD in the Zen 6 generation would be a significant achievement. It’s plausible that the IOD might continue to use the 6nm process to manage overall costs effectively.
If these developments hold true， the Zen 6 generation is likely to be branded as Ryzen 10000. Furthermore， AMD might release Ryzen 10000 X3D series products in 2027， which would be particularly exciting news for gaming enthusiasts eager for enhanced performance.
